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Xilinx Programmable IC Chips XCVU3P-2FFVC1517I

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    Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers
     
    Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers
    • Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers
    • Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers
    • Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers
    • Buy cheap Xilinx Programmable IC Chips XCVU3P-2FFVC1517I from wholesalers

    Xilinx Programmable IC Chips XCVU3P-2FFVC1517I

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    Brand Name : Xilinx
    Model Number : XCVU3P-2FFVC1517I
    Price : Please contact us
    Payment Terms : T/T, Western Union, PayPay, MoneyGram
    Supply Ability : 500pcs Per Mouth
    Delivery Time : 5-7work days
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    Xilinx Programmable IC Chips XCVU3P-2FFVC1517I

    Xilinx Ic Chip Programmer XCVU3P-2FFVC1517I 560 I/O 49260 LAB XCVU3P 40 Transceiver

    Specifications

    Product AttributeAttribute Value
    Xilinx
    Product Category:FPGA - Field Programmable Gate Array
    XCVU3P
    862050 LE
    560 I/O
    850 mV
    850 mV
    - 40 C
    + 100 C
    32.75 Gb/s
    40 Transceiver
    SMD/SMT
    FBGA-1517
    Distributed RAM:12 Mbit
    Embedded Block RAM - EBR:25.3 Mbit
    Number of Logic Array Blocks - LABs:49260 LAB
    Operating Supply Voltage:850 mV
    Product Type:FPGA - Field Programmable Gate Array

    Description

    Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements. Artix® UltraScale+ FPGAs: Highest serial bandwidth and signal compute density in a cost-optimized device for critical networking applications, vision and video processing, and secured connectivity.

    Kintex® UltraScale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.

    Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance peripherals and cost-effective system implementation.

    Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and application requirements through integration of various system-level functions.

    Virtex UltraScale+ FPGAs: The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory available in the UltraScale architecture.

    Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required

    system performance and the smallest power envelope. Zynq® UltraScale+ MPSoCs: Combine the Arm® v8-based

    Cortex®-A53 high-performance energy-efficient 64-bit application processor with the Arm Cortex-R5F real-time processor

    and the UltraScale architecture to create the industry's first programmable MPSoCs. Provide unprecedented power savings,

    heterogeneous processing, and programmable acceleration.

    Zynq® UltraScale+ RFSoCs: Combine RF data converter subsystem and forward error correction with industry-leading

    programmable logic and heterogeneous processing capability. Integrated RF-ADCs, RF-DACs, and soft decision

    FECs (SD-FEC) provide the key subsystems for multiband, multi-mode cellular radios and cable infrastructure.

    Features

    Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio frequency

    analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog converters (RF-DACs). The

    high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be individually configured for real data or

    in most cases can be configured in pairs for real and imaginary I/Q data. See RF-ADCs and RF-DACs sections

    Some Zynq UltraScale+ RFSoCs include highly flexible soft decision FEC blocks for decoding and encoding data

    as a means to control errors in data transmission over unreliable or noisy communication channels. The SD-FEC

    blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in 5G wireless, backhaul,

    DOCSIS, and LTE applications.

    Zynq UltraScale+ MPSoCs and RFSoCs feature dual and quad core variants of the Arm Cortex-A53 (APU) with dual-core

    Arm Cortex-R5F (RPU) processing system (PS). Some devices also include a dedicated Arm Mali™-400 MP2 graphics

    processing unit (GPU).

    Trading Guide

    ShippingDelivery period

    For in-stock parts, orders are estimated to ship out in 3 days.Once shipped, estimated delivery time depends on the below carriers you chose:
    DHL Express, 3-7 business days.
    DHL eCommerce,12-22 business days.
    FedEx International Priority, 3-7 business days
    EMS, 10-15 business days.
    Registered Air Mail, 15-30 business days.

    Shipping rates

    After confirming the order, we will evaluate the shipping cost based on the weight of the goods

    Shipping option

    We provide DHL, FedEx, EMS, SF Express, and Registered Air Mail international shipping.

    Shipping tracking

    We will notify you by email with tracking number once order is shipped.

    Returning

    warranty

    Returning

    Returns are normally accepted when completed within 30 days from date of shipment.Parts should be unused and in original packaging.Customer has to take charge for the shipping.

    Warranty

    All Retechip purchases come with a 30-day money-back return policy, This warranty shall not apply to any item where defects have been caused by improper customer assembly,failure by customer to follow instructions, product modification, negligent or improper operation

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    Payment

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