Programmable Ic XC7S50-2CSGA324C 7 Series FPGA 210 I/O 4075 Array Block CSGA-324

Specifications

Description

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements,

ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity

bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.

The 7 series FPGAs include:

• Spartan®-7 Family: Optimized for low cost, lowest power, and high I/O performance.

Available in low-cost, very small form-factor packaging for smallest PCB footprint.

• Artix®-7 Family: Optimized for

low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total

bill of materials cost for high-throughput, cost-sensitive applications.

• Kintex®-7 Family: Optimized for best

price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

• Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.

Highest capability devices enabled by stacked silicon interconnect (SSI) technology. Built on a state-of-the-art,

high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable

an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3

TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative

to ASSPs

Features

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable

as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s

up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters

with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized

symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM)

blocks for high precision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with

HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between

family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process

technology and 0.9V core voltage option for even lower power.

Trading Guide

Shenzhen Retechip® Electronic Technology Co., Ltd. was established in 2013, specializing in electronic components distribution business.The products are widely used in communication equipment, power supply, medical electronics, automotive electronics, digital electronics, industrial electronics, display modules, intelligent electronics, new energy, the Internet of things, 5G productsand other fields，With high-quality products, reasonable prices, rapid distributionand timely service, we can provide customers with the most cost-effective products and save customers a lot of time.